טוען...
Nondestructive shape process monitoring of three-dimensional high aspect ratio targets using through-focus scanning optical microscopy
Low-cost, high-throughput and nondestructive metrology of truly three-dimensional (3-D) targets for process control/monitoring is a critically needed enabling technology for high-volume manufacturing (HVM) of nano/micro technologies in multi-disciplinary areas. In particular, a survey of the typical...
שמור ב:
| הוצא לאור ב: | Meas Sci Technol |
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| Main Authors: | , , , , , |
| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
2018
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| נושאים: | |
| גישה מקוונת: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6512994/ https://ncbi.nlm.nih.gov/pubmed/31092982 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1088/1361-6501/aae4c2 |
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