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Nondestructive shape process monitoring of three-dimensional high aspect ratio targets using through-focus scanning optical microscopy

Low-cost, high-throughput and nondestructive metrology of truly three-dimensional (3-D) targets for process control/monitoring is a critically needed enabling technology for high-volume manufacturing (HVM) of nano/micro technologies in multi-disciplinary areas. In particular, a survey of the typical...

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Détails bibliographiques
Publié dans:Meas Sci Technol
Auteurs principaux: Attota, Ravi Kiran, Kang, Hyeonggon, Scott, Keana, Allen, Richard, Vladar, Andras E., Bunday, Benjamin
Format: Artigo
Langue:Inglês
Publié: 2018
Sujets:
Accès en ligne:https://ncbi.nlm.nih.gov/pmc/articles/PMC6512994/
https://ncbi.nlm.nih.gov/pubmed/31092982
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1088/1361-6501/aae4c2
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