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Nondestructive shape process monitoring of three-dimensional high aspect ratio targets using through-focus scanning optical microscopy
Low-cost, high-throughput and nondestructive metrology of truly three-dimensional (3-D) targets for process control/monitoring is a critically needed enabling technology for high-volume manufacturing (HVM) of nano/micro technologies in multi-disciplinary areas. In particular, a survey of the typical...
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| Publié dans: | Meas Sci Technol |
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| Auteurs principaux: | , , , , , |
| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
2018
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| Sujets: | |
| Accès en ligne: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6512994/ https://ncbi.nlm.nih.gov/pubmed/31092982 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1088/1361-6501/aae4c2 |
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