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Optimizing noise for defect analysis with through-focus scanning optical microscopy
Through-focus scanning optical microscopy (TSOM) shows promise for patterned defect analysis, but it is important to minimize total system noise. TSOM is a three-dimensional shape metrology method that can achieve sub-nanometer measurement sensitivity by analyzing sets of images acquired through-foc...
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| Published in: | Proc SPIE Int Soc Opt Eng |
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| Main Authors: | , |
| Format: | Artigo |
| Language: | Inglês |
| Published: |
2016
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| Subjects: | |
| Online Access: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5486224/ https://ncbi.nlm.nih.gov/pubmed/28663666 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1117/12.2220679 |
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