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Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown
The evolution of superconformal Cu electrodeposition in high aspect ratio through silicon vias (TSVs) is examined as a function of polymer suppressor concentration, applied potential and hydrodynamics. Electroanalytical measurements in a CuSO(4)-H(2)SO(4)-Cl electrolyte are used to explore and quant...
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| Publicat a: | J Electrochem Soc |
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| Autors principals: | , |
| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
2018
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| Matèries: | |
| Accés en línia: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7543049/ https://ncbi.nlm.nih.gov/pubmed/33041352 |
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