APA সাইটেশন

Josell, D., & Moffat, T. P. (2018). Superconformal Copper Deposition in Through Silicon Vias by Suppression-Breakdown. J Electrochem Soc.

শিকাগো স্টাইলে সাইটেশন

Josell, D., এবং T. P. Moffat. "Superconformal Copper Deposition in Through Silicon Vias By Suppression-Breakdown." J Electrochem Soc 2018.

এমএলএ সাইটেশন

Josell, D., এবং T. P. Moffat. "Superconformal Copper Deposition in Through Silicon Vias By Suppression-Breakdown." J Electrochem Soc 2018.