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Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction
This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO(4) + NiCl(2) + H(3)BO(3) electrolyte containing a branched polyethyleneimine suppressor. Feature filling occurs due to the interaction of transport limited suppressor adsorption and its consumption by potential...
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| Gepubliceerd in: | J Electrochem Soc |
|---|---|
| Hoofdauteurs: | , , , , |
| Formaat: | Artigo |
| Taal: | Inglês |
| Gepubliceerd in: |
2018
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| Onderwerpen: | |
| Online toegang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7537468/ https://ncbi.nlm.nih.gov/pubmed/33029030 |
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