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Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction

This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO(4) + NiCl(2) + H(3)BO(3) electrolyte containing a branched polyethyleneimine suppressor. Feature filling occurs due to the interaction of transport limited suppressor adsorption and its consumption by potential...

Disgrifiad llawn

Wedi'i Gadw mewn:
Manylion Llyfryddiaeth
Cyhoeddwyd yn:J Electrochem Soc
Prif Awduron: Braun, T. M., Kim, S.-H., Lee, H.-J., Moffat, T. P., Josell, D.
Fformat: Artigo
Iaith:Inglês
Cyhoeddwyd: 2018
Pynciau:
Mynediad Ar-lein:https://ncbi.nlm.nih.gov/pmc/articles/PMC7537468/
https://ncbi.nlm.nih.gov/pubmed/33029030
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