Llwytho...
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction
This work examines the filling of Through Silicon Vias (TSV) by Ni deposition from a NiSO(4) + NiCl(2) + H(3)BO(3) electrolyte containing a branched polyethyleneimine suppressor. Feature filling occurs due to the interaction of transport limited suppressor adsorption and its consumption by potential...
Wedi'i Gadw mewn:
| Cyhoeddwyd yn: | J Electrochem Soc |
|---|---|
| Prif Awduron: | , , , , |
| Fformat: | Artigo |
| Iaith: | Inglês |
| Cyhoeddwyd: |
2018
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| Pynciau: | |
| Mynediad Ar-lein: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7537468/ https://ncbi.nlm.nih.gov/pubmed/33029030 |
| Tagiau: |
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