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Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias
This work presents superconformal, bottom-up Au filling of high aspect ratio through silicon vias (TSVs) along with a predictive framework based on the coupling of suppression breakdown and surface topography. The work extends a previous study of superconformal Au deposition in lower aspect ratio TS...
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| Publié dans: | J Electrochem Soc |
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| Auteurs principaux: | , |
| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
2017
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| Sujets: | |
| Accès en ligne: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5514616/ https://ncbi.nlm.nih.gov/pubmed/28729743 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1149/2.1311706jes |
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