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Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias

This work presents superconformal, bottom-up Au filling of high aspect ratio through silicon vias (TSVs) along with a predictive framework based on the coupling of suppression breakdown and surface topography. The work extends a previous study of superconformal Au deposition in lower aspect ratio TS...

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Bibliografski detalji
Izdano u:J Electrochem Soc
Glavni autori: Josell, D., Moffat, T.P.
Format: Artigo
Jezik:Inglês
Izdano: 2017
Teme:
Online pristup:https://ncbi.nlm.nih.gov/pmc/articles/PMC5514616/
https://ncbi.nlm.nih.gov/pubmed/28729743
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1149/2.1311706jes
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