Loading...
Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias
This work presents superconformal, bottom-up Au filling of high aspect ratio through silicon vias (TSVs) along with a predictive framework based on the coupling of suppression breakdown and surface topography. The work extends a previous study of superconformal Au deposition in lower aspect ratio TS...
Na minha lista:
| Udgivet i: | J Electrochem Soc |
|---|---|
| Main Authors: | , |
| Format: | Artigo |
| Sprog: | Inglês |
| Udgivet: |
2017
|
| Fag: | |
| Online adgang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5514616/ https://ncbi.nlm.nih.gov/pubmed/28729743 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1149/2.1311706jes |
| Tags: |
Tilføj Tag
Ingen Tags, Vær først til at tagge denne postø!
|