Llwytho...
Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias
This work demonstrates void-free Cu filling of millimeter size Through Silicon Vias (mm-TSV) in an acid copper sulfate electrolyte using a combination of a poloxamine suppressor and chloride, analogous to previous work filling TSV that were an order of magnitude smaller in size. For high chloride co...
Wedi'i Gadw mewn:
| Cyhoeddwyd yn: | J Electrochem Soc |
|---|---|
| Prif Awduron: | , , , , |
| Fformat: | Artigo |
| Iaith: | Inglês |
| Cyhoeddwyd: |
2019
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| Pynciau: | |
| Mynediad Ar-lein: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7542680/ https://ncbi.nlm.nih.gov/pubmed/33041355 |
| Tagiau: |
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