Josell, D., Menk, L. A., Hollowell, A. E., Blain, M., & Moffat, T. P. (2019). Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias. J Electrochem Soc.
Style de citation ChicagoJosell, D., L. A. Menk, A. E. Hollowell, M. Blain, et T. P. Moffat. "Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias." J Electrochem Soc 2019.
Style de citation MLAJosell, D., et al. "Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias." J Electrochem Soc 2019.
Attention : ces citations peuvent ne pas être correctes à 100%.