Cargando...
Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias
This work demonstrates void-free nickel filling of 56 μm tall, annular Through Silicon Vias (TSVs) using a mechanism that couples suppression breakdown and surface topography to achieve controlled superconformal, void-free deposition. The chemistry, a Watts electrolyte containing a dilute suppressin...
Gardado en:
| Publicado en: | ECS Trans |
|---|---|
| Main Authors: | , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
2016
|
| Assuntos: | |
| Acceso en liña: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5830146/ https://ncbi.nlm.nih.gov/pubmed/29503673 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1149/2.1151607jes |
| Tags: |
Engadir etiqueta
Sen Etiquetas, Sexa o primeiro en etiquetar este rexistro!
|