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CMUT Fabrication Based On A Thick Buried Oxide Layer

We introduce a versatile fabrication process for direct wafer-bonded CMUTs. The objective is a flexible fabrication platform for single element transducers, 1D and 2D arrays, and reconfigurable arrays. The main process features are: A low number of litho masks (five for a fully populated 2D array);...

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Autori principali: Kupnik, Mario, Vaithilingam, Srikant, Torashima, Kazutoshi, Wygant, Ira O., Khuri-Yakub, Butrus T.
Natura: Artigo
Lingua:Inglês
Pubblicazione: 2010
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Accesso online:https://ncbi.nlm.nih.gov/pmc/articles/PMC3370668/
https://ncbi.nlm.nih.gov/pubmed/22685377
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1109/ULTSYM.2010.5935935
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