A carregar...

Evaluation of wafer bonded CMUTs with rectangular membranes featuring high fill factor

Increasing fill factor is one design approach used to increase average output displacement, output pressure, and sensitivity of capacitive micromachined ultrasonic transducers (CMUTs). For rectangular cells, the cell-to-cell spacing and the aspect ratio determine the fill factor. In this paper, we e...

ver descrição completa

Na minha lista:
Detalhes bibliográficos
Main Authors: Wong, Serena H., Kupnik, Mario, Zhuang, Xuefeng, Lin, Der-Song, Butts-Pauly, Kim, Khuri-Yakub, B.T.
Formato: Artigo
Idioma:Inglês
Publicado em: 2008
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC2766518/
https://ncbi.nlm.nih.gov/pubmed/18986902
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1109/TUFFC.897
Tags: Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!