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Evaluation of wafer bonded CMUTs with rectangular membranes featuring high fill factor
Increasing fill factor is one design approach used to increase average output displacement, output pressure, and sensitivity of capacitive micromachined ultrasonic transducers (CMUTs). For rectangular cells, the cell-to-cell spacing and the aspect ratio determine the fill factor. In this paper, we e...
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| Hauptverfasser: | , , , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
2008
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| Schlagworte: | |
| Online Zugang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC2766518/ https://ncbi.nlm.nih.gov/pubmed/18986902 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1109/TUFFC.897 |
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