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CMUT Fabrication Based On A Thick Buried Oxide Layer
We introduce a versatile fabrication process for direct wafer-bonded CMUTs. The objective is a flexible fabrication platform for single element transducers, 1D and 2D arrays, and reconfigurable arrays. The main process features are: A low number of litho masks (five for a fully populated 2D array);...
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| Autors principals: | , , , , |
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| Format: | Artigo |
| Idioma: | Inglês |
| Publicat: |
2010
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| Matèries: | |
| Accés en línia: | https://ncbi.nlm.nih.gov/pmc/articles/PMC3370668/ https://ncbi.nlm.nih.gov/pubmed/22685377 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1109/ULTSYM.2010.5935935 |
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