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Effect of Additives on the Direct Electrodeposition of Copper From Acid Solution Containing 20 g/L Copper (II)

The effect of 3–mercapto–1–propanesulfonate sodium salt (MPS), polyethylene glycol (PEG), thiourea (TU) and ethylenethiourea (ETU) on copper electrodeposition from acidic sulfate electrolyte with low Cu2+ concentration was investigated by linear sweep voltammetry (LSV), and chronoamperometric and el...

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Gardado en:
Principais autores: Heng Wang, Jianhang Hu, Kongzhai Li, Yu Wang, Feng Zhang, Hua Wang
Formato: Artigo
Idioma:Inglês
Publicado: Elsevier 2021-01-01
Series:International Journal of Electrochemical Science
Assuntos:
electrodeposition
low Cu2+ concentration
additives
nucleation
electrodeposit analysis
Acceso en liña:http://www.sciencedirect.com/science/article/pii/S1452398123008167
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