Effect of Additives on the Direct Electrodeposition of Copper From Acid Solution Containing 20 g/L Copper (II)
The effect of 3–mercapto–1–propanesulfonate sodium salt (MPS), polyethylene glycol (PEG), thiourea (TU) and ethylenethiourea (ETU) on copper electrodeposition from acidic sulfate electrolyte with low Cu2+ concentration was investigated by linear sweep voltammetry (LSV), and chronoamperometric and el...
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| Hauptverfasser: | , , , , , |
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| Format: | Artigo |
| Sprache: | Inglês |
| Veröffentlicht: |
Elsevier
2021-01-01
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| Schriftenreihe: | International Journal of Electrochemical Science |
| Schlagworte: | |
| Online-Zugang: | http://www.sciencedirect.com/science/article/pii/S1452398123008167 |
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