Effect of Additives on the Direct Electrodeposition of Copper From Acid Solution Containing 20 g/L Copper (II)

The effect of 3–mercapto–1–propanesulfonate sodium salt (MPS), polyethylene glycol (PEG), thiourea (TU) and ethylenethiourea (ETU) on copper electrodeposition from acidic sulfate electrolyte with low Cu2+ concentration was investigated by linear sweep voltammetry (LSV), and chronoamperometric and el...

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Detalles Bibliográficos

Autores principales:	Heng Wang, Jianhang Hu, Kongzhai Li, Yu Wang, Feng Zhang, Hua Wang
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	Elsevier 2021-01-01
Colección:	International Journal of Electrochemical Science
Materias:	electrodeposition low Cu2+ concentration additives nucleation electrodeposit analysis
Acceso en línea:	http://www.sciencedirect.com/science/article/pii/S1452398123008167
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