Effect of Additives on the Direct Electrodeposition of Copper From Acid Solution Containing 20 g/L Copper (II)

The effect of 3–mercapto–1–propanesulfonate sodium salt (MPS), polyethylene glycol (PEG), thiourea (TU) and ethylenethiourea (ETU) on copper electrodeposition from acidic sulfate electrolyte with low Cu2+ concentration was investigated by linear sweep voltammetry (LSV), and chronoamperometric and el...

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Detalhes bibliográficos

Principais autores:	Heng Wang, Jianhang Hu, Kongzhai Li, Yu Wang, Feng Zhang, Hua Wang
Formato:	Artigo
Idioma:	Inglês
Publicado em:	Elsevier 2021-01-01
coleção:	International Journal of Electrochemical Science
Assuntos:	electrodeposition low Cu2+ concentration additives nucleation electrodeposit analysis
Acesso em linha:	http://www.sciencedirect.com/science/article/pii/S1452398123008167
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