載入...
Research on the Protrusions Near Silicon-Glass Interface during Cavity Fabrication
Taking advantage of good hermeticity, tiny parasitic capacitance, batch mode fabrication, and compatibility with multiple bonding techniques, the glass-silicon composite substrate manufactured by the glass reflow process has great potential to achieve 3D wafer-level packaging for high performance. H...
Na minha lista:
| 發表在: | Micromachines (Basel) |
|---|---|
| Main Authors: | , , , , , , , , |
| 格式: | Artigo |
| 語言: | Inglês |
| 出版: |
MDPI
2019
|
| 主題: | |
| 在線閱讀: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6631805/ https://ncbi.nlm.nih.gov/pubmed/31234592 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10060420 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|