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Research on the Protrusions Near Silicon-Glass Interface during Cavity Fabrication
Taking advantage of good hermeticity, tiny parasitic capacitance, batch mode fabrication, and compatibility with multiple bonding techniques, the glass-silicon composite substrate manufactured by the glass reflow process has great potential to achieve 3D wafer-level packaging for high performance. H...
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| Опубликовано в: : | Micromachines (Basel) |
|---|---|
| Главные авторы: | , , , , , , , , |
| Формат: | Artigo |
| Язык: | Inglês |
| Опубликовано: |
MDPI
2019
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| Предметы: | |
| Online-ссылка: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6631805/ https://ncbi.nlm.nih.gov/pubmed/31234592 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10060420 |
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