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Research on the Protrusions Near Silicon-Glass Interface during Cavity Fabrication

Taking advantage of good hermeticity, tiny parasitic capacitance, batch mode fabrication, and compatibility with multiple bonding techniques, the glass-silicon composite substrate manufactured by the glass reflow process has great potential to achieve 3D wafer-level packaging for high performance. H...

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Библиографические подробности
Опубликовано в: :Micromachines (Basel)
Главные авторы: Zhang, Meng, Yang, Jian, He, Yurong, Yang, Fan, Zhao, Yongmei, Xue, Fen, Han, Guowei, Si, Chaowei, Ning, Jin
Формат: Artigo
Язык:Inglês
Опубликовано: MDPI 2019
Предметы:
Online-ссылка:https://ncbi.nlm.nih.gov/pmc/articles/PMC6631805/
https://ncbi.nlm.nih.gov/pubmed/31234592
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10060420
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