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Research on Wafer-Level MEMS Packaging with Through-Glass Vias
A MEMS fabrication process with through-glass vias (TGVs) by laser drilling was presented, and reliability concerns about MEMS packaging with TGV, likes debris and via metallization, were overcome. The via drilling process on Pyrex 7740 glasses was studied using a picosecond laser with a wavelength...
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| Gepubliceerd in: | Micromachines (Basel) |
|---|---|
| Hoofdauteurs: | , , , , , , |
| Formaat: | Artigo |
| Taal: | Inglês |
| Gepubliceerd in: |
MDPI
2018
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| Onderwerpen: | |
| Online toegang: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6356378/ https://ncbi.nlm.nih.gov/pubmed/30597830 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10010015 |
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