טוען...
Research on Wafer-Level MEMS Packaging with Through-Glass Vias
A MEMS fabrication process with through-glass vias (TGVs) by laser drilling was presented, and reliability concerns about MEMS packaging with TGV, likes debris and via metallization, were overcome. The via drilling process on Pyrex 7740 glasses was studied using a picosecond laser with a wavelength...
שמור ב:
| הוצא לאור ב: | Micromachines (Basel) |
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| Main Authors: | , , , , , , |
| פורמט: | Artigo |
| שפה: | Inglês |
| יצא לאור: |
MDPI
2018
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| נושאים: | |
| גישה מקוונת: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6356378/ https://ncbi.nlm.nih.gov/pubmed/30597830 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10010015 |
| תגים: |
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