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Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via †
A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive microelectromechanical systems (MEMS) sensors is studied. The composite substrate with through silicon via (TSV) is used as the encapsulation cap fabricated by a glass-in-silicon (GIS) reflow process. In particular,...
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| Publicado no: | Sensors (Basel) |
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| Main Authors: | , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2018
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6339255/ https://ncbi.nlm.nih.gov/pubmed/30597879 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/s19010093 |
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