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Research on Wafer-Level MEMS Packaging with Through-Glass Vias
A MEMS fabrication process with through-glass vias (TGVs) by laser drilling was presented, and reliability concerns about MEMS packaging with TGV, likes debris and via metallization, were overcome. The via drilling process on Pyrex 7740 glasses was studied using a picosecond laser with a wavelength...
Shranjeno v:
| izdano v: | Micromachines (Basel) |
|---|---|
| Main Authors: | , , , , , , |
| Format: | Artigo |
| Jezik: | Inglês |
| Izdano: |
MDPI
2018
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| Teme: | |
| Online dostop: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6356378/ https://ncbi.nlm.nih.gov/pubmed/30597830 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/mi10010015 |
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