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Cryogenic Etching of High Aspect Ratio 400 nm Pitch Silicon Gratings
The cryogenic process and Bosch process are two widely used processes for reactive ion etching of high aspect ratio silicon structures. This paper focuses on the cryogenic deep etching of 400 nm pitch silicon gratings with various etching mask materials including polymer, Cr, SiO(2) and Cr-on-polyme...
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| Publicado no: | J Microelectromech Syst |
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| Main Authors: | , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
2016
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC5084849/ https://ncbi.nlm.nih.gov/pubmed/27799726 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1109/JMEMS.2016.2593339 |
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