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Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu
Direct Cu-to-Cu bonding was achieved at temperatures of 150–250 °C using a compressive stress of 100 psi (0.69 MPa) held for 10–60 min at 10(−3) torr. The key controlling parameter for direct bonding is rapid surface diffusion on (111) surface of Cu. Instead of using (111) oriented single crystal of...
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| Publicado no: | Sci Rep |
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| Main Authors: | , , , , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Nature Publishing Group
2015
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4649891/ https://ncbi.nlm.nih.gov/pubmed/25962757 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/srep09734 |
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