APA引文

Liu, C., Lin, H., Huang, Y., Chu, Y., Chen, C., Lyu, D., . . . Tu, K. (2015). Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu. Sci Rep.

Citação norma Chicago

Liu, Chien-Min, Han-Wen Lin, Yi-Sa Huang, Yi-Cheng Chu, Chih Chen, Dian-Rong Lyu, Kuan-Neng Chen, and King-Ning Tu. "Low-temperature Direct Copper-to-copper Bonding Enabled By Creep On (111) Surfaces of Nanotwinned Cu." Sci Rep 2015.

MLA引文

Liu, Chien-Min, et al. "Low-temperature Direct Copper-to-copper Bonding Enabled By Creep On (111) Surfaces of Nanotwinned Cu." Sci Rep 2015.