A carregar...
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
Highly (111)-oriented Cu pillar-bumps were bonded to highly (111)-oriented Cu films at temperatures ranging from 200 °C/100 °C to 350 °C/100 °C in N(2) ambient conditions. The microstructures of the bonded interfaces affected the shear strength performance of the bonded Cu joints. The bonded interfa...
Na minha lista:
| Publicado no: | Materials (Basel) |
|---|---|
| Main Authors: | , , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
MDPI
2018
|
| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC6316891/ https://ncbi.nlm.nih.gov/pubmed/30477274 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma11122368 |
| Tags: |
Adicionar Tag
Sem tags, seja o primeiro a adicionar uma tag!
|