High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating
This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase...
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| Hlavní autoři: | , , , , , |
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| Médium: | Artigo |
| Jazyk: | Inglês |
| Vydáno: |
MDPI AG
2022-12-01
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| Edice: | Micromachines |
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| On-line přístup: | https://www.mdpi.com/2072-666X/13/12/2159 |
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