High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating
This paper investigates a moiré-based mark for high-precision wafer bonding alignment. During alignment, the mark is combined with digital grating, which has the benefits of high precision and small size. A digital grating is superimposed on the mark to generate moiré fringes. By performing a phase...
Enregistré dans:
| Auteurs principaux: | , , , , , |
|---|---|
| Format: | Artigo |
| Langue: | Inglês |
| Publié: |
MDPI AG
2022-12-01
|
| Collection: | Micromachines |
| Sujets: | |
| Accès en ligne: | https://www.mdpi.com/2072-666X/13/12/2159 |
| Tags: |
Pas de tags, Soyez le premier à ajouter un tag!
|