FCCSP IMC growth under reliability stress follows automotive criteria
Purpose – The Kirkendall void had been a well-known issue for long-term reliability of semiconductor interconnects; while even the KVs exist at the interfaces of Cu and Sn, it may still be able to pass the condition of unbias long-term reliability testing, especially for 2,000 cycles of temperature...
محفوظ في:
| المؤلفون الرئيسيون: | , , |
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| التنسيق: | Artigo |
| اللغة: | Inglês |
| منشور في: |
Emerald Publishing
2019-03-01
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| سلاسل: | PSU Research Review |
| الموضوعات: | |
| الوصول للمادة أونلاين: | https://www.emerald.com/insight/content/doi/10.1108/PRR-12-2017-0046/full/pdf |
| الوسوم: |
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