Effect of Cu Foam on the Thermal Ｒesistance and Strength of As-soldered Pb5Sn2. 5Ag /Cu Joints
The service temperature of power electronic components is much higher than normal temperature， and the mismatch between heat generation and heat dissipation of devices is becoming increasingly prominent. The good thermal conductivity of foamed Cu is used to fill the welding material with PbSnAg al...
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| Principais autores: | , |
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| Formato: | Artigo |
| Idioma: | Chinês |
| Publicado em: |
Harbin University of Science and Technology Publications
2021-06-01
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| coleção: | Journal of Harbin University of Science and Technology |
| Assuntos: | |
| Acesso em linha: | https://hlgxb.hrbust.edu.cn/#/digest?ArticleID=1972 |
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