The Effect of Eutectic Structure on the Creep Properties of Sn-3.0Ag-0.5Cu and Sn-8.0Sb-3.0Ag Solders
Solder joints are the main weak points of power modules used in harsh environments. For the power module of electric vehicles, the maximum operating temperature of a chip can reach 175 °C under driving conditions. Therefore, it is necessary to study the high-temperature reliability of solder joints....
Bewaard in:
| Hoofdauteurs: | , , , , |
|---|---|
| Formaat: | Artigo |
| Taal: | Inglês |
| Gepubliceerd in: |
MDPI AG
2017-12-01
|
| Reeks: | Metals |
| Onderwerpen: | |
| Online toegang: | https://www.mdpi.com/2075-4701/7/12/540 |
| Tags: |
Geen labels, Wees de eerste die dit record labelt!
|