Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heating

Microwave hybrid heating (MHH) is a possible approach for soldering; yet, the long-term reliability of solder joints is still unclear. In this work, a comparative study was carried out on the influence of isothermal aging on SAC305/Cu solder joints by conventional reflow and MHH. The conventional re...

Descripción completa

Detalles Bibliográficos

Autores principales:	Mardiana Said, Nurulakmal Mohd Sharif, Muhammad Firdaus Mohd Nazeri, Soorathep Kheawhom, Ahmad Azmin Mohamad
Formato:	Artigo
Lenguaje:	Inglês
Publicado:	Elsevier 2022-03-01
Colección:	Journal of Materials Research and Technology
Materias:	Interfacial reaction Tensile strength Isothermal aging Sn-3.0Ag-0.5Cu solder Microwave hybrid heating
Acceso en línea:	http://www.sciencedirect.com/science/article/pii/S2238785422000850
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!