Microstructural and mechanical properties of Sn58Bi/Sn3.0Ag0.5Cu hybrid solder joints containing TiC nanoparticle additions
Sn–Bi-based solders have attracted considerable attention as promising materials for use in low-temperature soldering processes due to their low melting point of 139 °C and their excellent wettability. However, their long-term reliability is limited by the inherent brittleness of the Bi-rich phase....
Salvato in:
| Autori principali: | , |
|---|---|
| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Elsevier
2025-11-01
|
| Serie: | Journal of Materials Research and Technology |
| Soggetti: | |
| Accesso online: | http://www.sciencedirect.com/science/article/pii/S2238785425024676 |
| Tags: |
Nessun Tag, puoi essere il primo ad aggiungerne!!
|