Microstructural and mechanical properties of Sn58Bi/Sn3.0Ag0.5Cu hybrid solder joints containing TiC nanoparticle additions
Sn–Bi-based solders have attracted considerable attention as promising materials for use in low-temperature soldering processes due to their low melting point of 139 °C and their excellent wettability. However, their long-term reliability is limited by the inherent brittleness of the Bi-rich phase....
保存先:
| 主要な著者: | , |
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| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
Elsevier
2025-11-01
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| シリーズ: | Journal of Materials Research and Technology |
| 主題: | |
| オンライン･アクセス: | http://www.sciencedirect.com/science/article/pii/S2238785425024676 |
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