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IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique

Intermetallic compound(s) (IMC) that nucleates at the interface between solder and Cu trace during a soldering reaction, is one of the most crucial factors for microelectronic packaging reliability. This study was conducted to modify the IMC microstructure and to reinforce the mechanical strength of...

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Principais autores: C.E. Ho, S.P. Yang, P.T. Lee, C.Y. Lee, C.C. Chen, T.T. Kuo
Format: Artigo
Sprog:Inglês
Udgivet: Elsevier 2021-03-01
Serier:Journal of Materials Research and Technology
Fag:
Cu
Surface finish
IGEPIG
IMC
Molten solder channel
HSBS
Online adgang:http://www.sciencedirect.com/science/article/pii/S2238785421001551
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