Identification of the role of zinc in Sn–Cu solder and interfacial intermetallic growth through experimental results and phase-field simulations

Intermetallic compound (IMC) formation significantly impacts the reliability of lead-free solder joints, with trace elements like Ni and Zn offering potential to control IMC growth. However, the mechanisms by which trace Zn influences microstructural evolution and interfacial reactions remain undere...

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Bibliografiske detaljer

Principais autores:	H.R. Kotadia, A. Rahnama, F. Tang, J.I. Ahuir-Torres, G. West, A. Das, S.H. Mannan
Format:	Artigo
Sprog:	Inglês
Udgivet:	Elsevier 2025-12-01
Serier:	Materials & Design
Fag:	Sn-Cu solder Pb-free solder Intermetallic compounds (IMCs) Solidification Phase-field simulations
Online adgang:	http://www.sciencedirect.com/science/article/pii/S0264127525016405
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