Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology

In the era of big data, the advantages of 3D packaging are becoming increasingly significant. In addition, the mismatch between the coefficient of thermal expansion (CTE) of the PCB and BGA components leads to dynamic warpage of the system, and the expansion and innovation of low-temperature solderi...

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書誌詳細

主要な著者:	Xuefeng Wu, Lingyao Sun, Yingxia Liu, Ziting Ye, Xiuchen Zhao, Ying Liu
フォーマット:	Artigo
言語:	Inglês
出版事項:	Elsevier 2023-05-01
シリーズ:	Journal of Materials Research and Technology
主題:	Solid-liquid low-temperature soldering Mixed solder joints Shearing strength Advanced packaging
オンライン･アクセス:	http://www.sciencedirect.com/science/article/pii/S2238785423009298
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