Structure and properties of Sn-Cu lead-free solders in electronics packaging
With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacia...
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| Autori principali: | , , , , |
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| Natura: | Artigo |
| Lingua: | Inglês |
| Pubblicazione: |
Taylor & Francis Group
2019-12-01
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| Serie: | Science and Technology of Advanced Materials |
| Soggetti: | |
| Accesso online: | http://dx.doi.org/10.1080/14686996.2019.1591168 |
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