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Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling
Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2...
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| Publicado en: | Sci Rep |
|---|---|
| Main Authors: | , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado: |
Nature Publishing Group UK
2021
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| Assuntos: | |
| Acceso en liña: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7973770/ https://ncbi.nlm.nih.gov/pubmed/33737642 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1038/s41598-021-85685-6 |
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