Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint

The evolution of internal compressive stress from the intermetallic compound (IMC) Cu(6)Sn(5) growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisk...

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Detalhes bibliográficos
Publicado no:Materials (Basel)
Main Authors: Hashim, Aimi Noorliyana, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Ramli, Muhammad Mahyiddin, Yee, Khor Chu, Mohd Mokhtar, Noor Zaimah, Chaiprapa, Jitrin
Formato: Artigo
Idioma:Inglês
Publicado em: MDPI 2021
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Article
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC7914571/
https://ncbi.nlm.nih.gov/pubmed/33562471
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma14040738
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