Cita APA

Hashim, A. N., Salleh, M. A. A. M., Sandu, A. V., Ramli, M. M., Yee, K. C., Mohd Mokhtar, N. Z., & Chaiprapa, J. (2021). Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint. Materials (Basel).

Citación estilo Chicago

Hashim, Aimi Noorliyana, Mohd Arif Anuar Mohd Salleh, Andrei Victor Sandu, Muhammad Mahyiddin Ramli, Khor Chu Yee, Noor Zaimah Mohd Mokhtar, y Jitrin Chaiprapa. "Effect of Ni On the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint." Materials (Basel) 2021.

Cita MLA

Hashim, Aimi Noorliyana, et al. "Effect of Ni On the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint." Materials (Basel) 2021.