Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow

Solder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead (Pb)-free solder with the addition of 1.0 wt....

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Bibliografische gegevens
Hoofdauteurs: Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al-Bakri Abdullah, Nur Izzati Muhammad Nadzri, Andrei Victor Sandu, Petrica Vizureanu, Mohd Izrul Izwan Ramli, Kazuhiro Nogita, Hideyuki Yasuda, Ioan Gabriel Sandu
Formaat: Artigo
Taal:Inglês
Gepubliceerd in: MDPI AG 2022-04-01
Reeks:Materials
Onderwerpen:
multiple reflows
synchrotron
composite solder
Online toegang:https://www.mdpi.com/1996-1944/15/8/2758
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