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3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity

In this study, hybrid fillers of spherically shaped aggregated boron nitride (a-BN) attached with SAC305, were fabricated via simple stirring and the vacuum filtration method. a-BN was used as the primary conductive filler incorporated with epoxy resin, and these fillers were interconnected each oth...

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Bibliografiska uppgifter
I publikationen:Polymers (Basel)
Huvudupphovsmän: Kim, Youjin, Kim, Jooheon
Materialtyp: Artigo
Språk:Inglês
Publicerad: MDPI 2020
Ämnen:
Länkar:https://ncbi.nlm.nih.gov/pmc/articles/PMC7564005/
https://ncbi.nlm.nih.gov/pubmed/32872327
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/polym12091954
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