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Thermal Conductivity and Cure Kinetics of Epoxy-Boron Nitride Composites—A Review
Epoxy resin composites filled with thermally conductive but electrically insulating particles play an important role in the thermal management of modern electronic devices. Although many types of particles are used for this purpose, including oxides, carbides and nitrides, one of the most widely use...
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| 出版年: | Materials (Basel) |
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| 主要な著者: | , |
| フォーマット: | Artigo |
| 言語: | Inglês |
| 出版事項: |
MDPI
2020
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| 主題: | |
| オンライン･アクセス: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7476057/ https://ncbi.nlm.nih.gov/pubmed/32824496 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/ma13163634 |
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