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Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers
A solvent-free method for the fabrication of thermally conductive epoxy-boron nitride (BN) nanoplatelet composite material is developed in this study. By this method, polymer composites with nearly any filler fractions can be easily fabricated. The maximum thermal conductivity reaches 5.24 W/mK, whi...
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| Publicado no: | Nanoscale Res Lett |
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| Main Authors: | , , , |
| Formato: | Artigo |
| Idioma: | Inglês |
| Publicado em: |
Springer
2014
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| Assuntos: | |
| Acesso em linha: | https://ncbi.nlm.nih.gov/pmc/articles/PMC4257055/ https://ncbi.nlm.nih.gov/pubmed/25489292 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1186/1556-276X-9-643 |
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