Lanean...
3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity
In this study, hybrid fillers of spherically shaped aggregated boron nitride (a-BN) attached with SAC305, were fabricated via simple stirring and the vacuum filtration method. a-BN was used as the primary conductive filler incorporated with epoxy resin, and these fillers were interconnected each oth...
Gorde:
| Argitaratua izan da: | Polymers (Basel) |
|---|---|
| Egile Nagusiak: | , |
| Formatua: | Artigo |
| Hizkuntza: | Inglês |
| Argitaratua: |
MDPI
2020
|
| Gaiak: | |
| Sarrera elektronikoa: | https://ncbi.nlm.nih.gov/pmc/articles/PMC7564005/ https://ncbi.nlm.nih.gov/pubmed/32872327 https://ncbi.nlm.nih.govhttp://dx.doi.org/10.3390/polym12091954 |
| Etiketak: |
Etiketa erantsi
Etiketarik gabe, Izan zaitez lehena erregistro honi etiketa jartzen!
|