Kim, Y., & Kim, J. (2020). 3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity. Polymers (Basel).
Citação norma ChicagoKim, Youjin, and Jooheon Kim. "3D Interconnected Boron Nitride Networks in Epoxy Composites Via Coalescence Behavior of SAC305 Solder Alloy As a Bridging Material for Enhanced Thermal Conductivity." Polymers (Basel) 2020.
Citação norma MLAKim, Youjin, and Jooheon Kim. "3D Interconnected Boron Nitride Networks in Epoxy Composites Via Coalescence Behavior of SAC305 Solder Alloy As a Bridging Material for Enhanced Thermal Conductivity." Polymers (Basel) 2020.
Nota: a formatação da citação pode não corresponder 100% ao definido pela respectiva norma.