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Low Temperature CMUT Fabrication Process with Dielectric Lift-off Membrane Support for Improved Reliability

This paper reports an improved CMOS compatible low temperature sacrificial layer fabrication process for Capacitive Micromachined Ultrasonic Transducers (CMUTs). The process adds the fabrication step of silicon oxide evaporation which is followed by a lift-off step to define the membrane support are...

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Detalhes bibliográficos
Publicado no:J Micromech Microeng
Main Authors: Pirouz, Amirabbas, Degertekin, F. Levent.
Formato: Artigo
Idioma:Inglês
Publicado em: 2018
Assuntos:
Acesso em linha:https://ncbi.nlm.nih.gov/pmc/articles/PMC5958899/
https://ncbi.nlm.nih.gov/pubmed/29785066
https://ncbi.nlm.nih.govhttp://dx.doi.org/10.1088/1361-6439/aabe0c
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